Ho-Chiao Chuang, PhD
Mechanical Engineering, National Taipei University of Technology, Taiwan
Ho-Chiao Chuang earned a B.S. in mechanical engineering at Da-Yeh University, Taiwan, in 2000 and a M.S. in the Department of Power Mechanical Engineering at National Tsing-Hua University, Taiwan, in 2002.
He joined Professor Victor Bright’s MEMS group in 2004 and earned his Ph.D. in 2008 from the Department of Mechanical Engineering at the University of Colorado at Boulder, USA. He joined Dept. of Mechanical Engineering, National Taipei University of Technology, Taiwan, since 2009.02. His current research interests include the fabrication of through silicon vias (TSV) for 3D IC, ultra-high aspect ratio of the TSV by using the supercritical CO2 electroplating process, the development of new biomedical instruments especially in the aspect of counteraction treatment couch for respiration-induced tumor motion, and development of novel energy saving technology for different application fields.